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l a t e s t   p r e s s   r e l e a s e s • July 15, 2002 New EZPhone is Easy on Power • June 24, 2002 XE8000 ProStart II, A Smart Development Tool for XE8000 Microcontroller Based Products • June 11, 2002 Listen In With EasyBlue™ • May 27, 2002 Biocontrol and XEMICS Announce the First Human Implantation of the MiniatURO™ • May 6, 2002 RFast; XEMICS' Fast RF Evaluation and Development Environment • May 1, 2002 Growing demand fuels XEMICS Asia-Pacific expansion • February 11, 2002 XEMICS Unleashes its 900MHz Ultra Low-Power Transceiver ! • January 28, 2002 The most cost effective wireless headset yet • January 15, 2002 Dedicated Ultra-Low Power Microcontroller for RF Communication • December 17, 2001 XEMICS And PHYTON join forces to create an In-Circuit-Emulator • See all the news

XEMICS provides an effective solution to all VHF receiver problems: the XE1218     Neuchâtel, Switzerland and Mountain View, CA April 11, 2000       ''The continual developments in wireless & hand-held battery applications make issues like low voltage and miniature size of critical importance'' commented Rйmy Pache President of XEMICS USA With this in mind, XEMICS has designed a complete system-on-chip, (SoC), that provides a current consumption level that corresponds to 2mA down to 1V. This ensures prolonged product battery life, a higher frequency-band-width, (130-230 MHz), and a miniature chip with very few external components; together these features provide optimized product modularity. The XE1218 is a device that receives voice audio and typically applies to consumer applications like wireless headsets, toys, local wide area voice pagers and FM miniature receivers. Based on a low IF architecture, the circuit comprises a RF receiver section, a demodulator, and an audio amplifier that, wherever needed, can be fitted directly to an external earpiece. Indeed the chip also has a LNA output that directly interfaces with the antenna; the XE1218 has additional features such as an on-chip channel filter and delay line type demodulator. At present, the SoC can be delivered in naked die form and will soon be available also in packaged format.